Replacing the system processor module in the 8348-21C system
Learn how to replace the system processor module in the IBM® Power® System S812LC (8348-21C) system.
Procedure
- Ensure that you have the electrostatic discharge (ESD) wrist strap attached. If not, attach it now.
- Remove dust and debris from the system processor socket area. If dust or debris is present, use the supplied air pump (part number 45D2645) to clean the system processor socket area.
- Prepare the system processor module for installation:
- Remove the replacement processor module from the shipping tray. Using the supplied removal tool (part number 01AF101), align the beveled corner (A) of the tool over the beveled corner of the module, as shown in Figure 1.
- Lower the tool over the system processor module by ensuring that the two guide pins (C) are inserted into the alignment holes (B) on each side of the tool, as shown in Figure 1. Then, push down on the tool to lock the system processor module into the tool, as shown in Figure 2. Do not press the blue release tabs until directed to do so later.
Figure 1. Aligning the removal toolFigure 2. Locking the system processor module into the tool - Prepare for system processor module
installation:
- Grasping the sides of the tool and system processor module, carefully lift it slightly out of the system processor module tray. Then, turn it over so that the system processor module side is up.
- Ensure that both jaws (A) are firmly grabbing
the system processor module, as shown in Figure 3. Note: If both jaws are not firmly grabbing the system processor module, press down on the corner of the system processor module closest to the jaw until it locks into place. Do not touch any part of the system processor module other than the corners.
Figure 3. Preparing for system processor module installation - Install the system processor module:
- If dust or debris is present on the system processor socket, use
the supplied air pump (part number 45D2645) to clean the socket. Blow
small bursts of air from the center toward the sides of the socket,
as shown Figure 4.Figure 4. Removing dust and debris from the system processor socket
- Lower the tool and system processor module onto the socket. Align
the beveled corner (A) of the tool with the
beveled corner on the socket. Ensure that the two guide pins (C) are
inserted into the alignment holes (B) on each
side of the tool. Use care to lower the tool evenly without tilting
the tool. See Figure 5. Note: Do not attempt to slide the tool and the system processor module in any direction while the system processor module is touching the socket. If the tool and the system processor module are not aligned with the guide pins, lift the tool and the system processor module and reposition them.Figure 5. Installing the system processor module
- After the tool and system processor module holes and guide pins
are properly aligned, squeeze and hold the two blue release tabs (A) together
until a firm stop is reached, as shown in Figure 6. Then, lift the tool
off the system processor module.Figure 6. Removing the system processor module tool
- If dust or debris is present on the system processor socket, use
the supplied air pump (part number 45D2645) to clean the socket. Blow
small bursts of air from the center toward the sides of the socket,
as shown Figure 4.
- Inspect the thermal interface material (TIM) for visible signs of damage, as shown in Figure 7.
The thermal interface material (TIM) is typically adhered to the heat sink. Unless damaged, the TIM that is adhered to the heat sink can be reused. If the TIM is damaged, do not reuse the removed heat sink. Ensure that you have a spare TIM and heat sink on hand, part number 01AF286.
Figure 7. Inspecting the thermal interface material - Are you replacing the TIM or heat sink?
- Yes:
- Continue with step 8.
- No:
- Go to step 9.
- Install a new TIM pad:
- If the TIM or heat sink must be replaced, order part number 01AF286, heat sink and TIM.
- Open the TIM packaging and carefully remove the TIM, holding it by the edges of the carrier strip and holding it away from the shipping container.
- Remove the protective film from the clear carrier strip by using the supplied tweezers.Note: The TIM must remain flat. Small wrinkles are acceptable, but folds are not acceptable.
- Using the tweezers, remove the TIM from the carrier strip and center it onto the system
processor module. The side with the red stripe must be facing up. Align the beveled edges of the TIM
and the system processor module (A), as shown in Figure 8.Figure 8. Installing the TIM onto the processor lid
- Install the heat sink:
- Position the heat sink by using the guide holes on the heat sink (A) to correctly align it with the guide pins (B). See Figure 9.
- Ensure that the heat sink load arms are engaged. Figure 9. Installing the heat sink
- A hex key wrench is attached to the rear of the chassis. Use that hex key to tighten the center
load screw (B) clockwise until a firm stop is reached. If the heat sink moves
noticeably, the load arms (A) are not engaged. Unscrew the center load screw
and repeat this step again. See Figure 10. Figure 10. Tightening the center load screw on the heat sink
- Replace the processor air baffle. For instructions, see Replacing the processor baffle in an 8348-21C system.
- Lightly grip the system processor module
that you replaced by the edges and lift it off of the packaging cover.
Align the beveled corner of the module (A) to
the corner of the packaging with triangle (B) and
place it in the packaging, as shown in Figure 11. Close the packaging
cover. Figure 11. Placing the system processor module into the packaging
What to do next
Prepare the system for operation. For instructions, see Preparing the system for operation after removing and replacing internal parts for the 8348-21C.
Last updated: Wed, May 24, 2017